Dynamic Dielectric Spectroscopy System
Multi-dimensional material characterisation under controlled mechanical stress
Image represents the actual instrumentation developed for this project. Technical details have been abstracted for confidentiality purposes.
Challenge
Elastomeric and flexible materials exhibit electrical properties that change significantly under mechanical deformation. Standard impedance measurement systems cannot simultaneously control mechanical stress while performing electrical characterisation, requiring separate test setups and making correlation difficult. Understanding material behaviour under real-world stress conditions requires integrated mechanical and electrical testing with precise displacement control.
Solution
Integrated electromechanical platform built using modular engineering design principles. Combines custom precision parallel-plate electrode system with motorised linear stage and previously developed LCR impedance spectroscopy software. The modular approach demonstrates how reusable instrumentation blocks can be combined to create systems of higher complexity, enabling multi-dimensional material characterisation in a single automated test cycle.
Key Technical Features
- • Precision parallel plate electrodes with distributed current design
- • 4-wire Kelvin measurement using standard 50Ω BNC connections
- • Eliminates setup electrical properties for improved accuracy
- • Sub-millimetre displacement control via motorised single-axis stage
- • Perfect parallel plate alignment maintained throughout displacement
- • Programmatic control integrating motion with impedance spectroscopy
- • Multi-dimensional characterisation: impedance vs. frequency vs. compression
- • Adaptable design for both compressible and stretchable materials
- • Modular architecture leveraging previously developed LCR spectroscopy software
- • Automated testing cycles across compression/tension and frequency ranges
Applications
Dielectric Elastomer Characterisation
Material property mapping under mechanical stress
Capacitive Sensor Development
Flexible sensor material optimisation
Flexible Electronics Research
Material behaviour under bending and stretching
Soft Robotics Testing
Electroactive polymer characterisation